文献类型：期刊文献

英文题名：On a simplified multi-layered plate model of growth: Asymptotic analyses and numerical implementation

作者：Du, Ping[1];Wang, Fan-Fan[2];Wang, Jiong[1,3]

机构：[1]South China Univ Technol, Sch Civil Engn & Transportat, Guangzhou 510640, Peoples R China;[2]East China Univ Sci & Technol, Sch Math, Shanghai 200237, Peoples R China;[3]South China Univ Technol, State Key Lab Subtrop Bldg Sci, Guangzhou 510640, Peoples R China

年份：2023

卷号：191

外文期刊名：THIN-WALLED STRUCTURES

收录：;EI(收录号：20233514646813);WOS:【SCI-EXPANDED(收录号:WOS:001164228300001)】；

语种：英文

外文关键词：Soft material; Growth-induced deformation; Multi-layered plate model; Asymptotic analysis; Numerical simulation

摘要：In this paper, a simplified multi-layered plate model is proposed, which can be used to study the growth-induced deformations of multi-layered hyperelastic plates. First, we introduce a full-form multi-layered plate theory of growth, which has a relatively complicated plate equation system. To simplify the plate equations, systematic asymptotic analyses are conducted with some specified magnitudes of growth functions and surface tractions. It is found that the terms containing a high-order stress tensor always have higher asymptotic orders. By dropping these higher-order terms from the original plate equations, a simplified multi-layered plate model can be derived. Despite its simplicity, this new plate model is valid in a wide range of growth and loading conditions. To be prepared for practical applications, the associated weak forms of the simplified plate equations are derived and implemented in a finite element software. Some typical examples are further studied to show the efficiency of the plate model. By virtue of the plate model, the growth deformations of multi-layered plate samples are simulated, which show very good consistency with the results of 3D volume model. Especially, the distributions of residual stresses on the interfaces of different layers can be predicted accurately, which has an important meaning for the design of soft devices with multi-layered plate structures.