文献类型：期刊文献

英文题名：Unveiling the potential and mechanisms of 3,3′-bicarbazole-based quaternary ammonium salts as levelers

作者：Yuan, Bo[1,2];Chen, Xin[1,2];Zhao, Yilin[3];Zhou, Wenhao[1,2];Li, Xuyang[1,2];Wang, Limin[1,2]

机构：[1]East China Univ Sci & Technol, Sch Chem & Mol Engn, Shanghai Key Lab Funct Mat Chem, 130 Meilong Rd, Shanghai 200237, Peoples R China;[2]East China Univ Sci & Technol, Inst Fine Chem, Sch Chem & Mol Engn, 130 Meilong Rd, Shanghai 200237, Peoples R China;[3]Fudan Univ, Collaborat Innovat Ctr Chem Energy Mat, Shanghai Key Lab Mol Catalysis & Innovat Mat, MOE Lab Computat Phys Sci,Dept Chem, Shanghai 200438, Peoples R China

年份：2023

卷号：471

外文期刊名：ELECTROCHIMICA ACTA

收录：;EI(收录号：20234314958394);WOS:【SCI-EXPANDED(收录号:WOS:001099458700001)】；

基金：This research was financially supported by the National Natural Science Foundation of China (21772039, 21272069), and we gratefully acknowledged financial support from the Central Universities and Science and Technology Commission of Shanghai Municipality (21DZ2305000). Support from the Fundamental Research Funds for the Central Universities (SLA13223001).

语种：英文

外文关键词：3,3' -Bicarbazole; Nucleation process; Electroplating leveler; Quantum chemical calculations

摘要：It is important to introduce an effective leveler into electroplating bath to meet the desired requirement in the electronic industry. This work explored the impact of larger backbone structures of four 3,3'-bicarbazole quaternary ammonium salts on the performance of promising levelers in light of the ambiguous mechanism of action. For the first time, these four compounds have been functionalized and identified as promising levelers for copper electrodeposition in through holes. Electrochemical measurements, theoretical calculations, and dynamics simulations collectively revealed that among these levelers, BCz-BPD exhibits the tendency of optimal adsorption on the cathode with the strongest inhibition of copper deposition. Chronoamperometry tests were carried out to analyze the copper nucleation model during electroplating. By measuring the electrostatic potential, average local ionization energy, and planarity, the leveling mechanism of BCz-BPD leveler was analyzed. In order to confirm the high through-hole filling and excellent leveling performance of BCz-BPD in actual PCB plating, TP value measurement, SEM, and XRD tests were carried out sequentially. In addition, galvanostatic measurements were performed to study the interaction of BCz-BPD leveler with other kinds of additives.