文献类型：期刊文献

英文题名：Study on novel silicon-containing dipropargyl ethers

作者：Dong, Sikun[1]; Yuan, Qiaolong[1]; Xu, Qian[1]; Huang, Farong[1]

机构：[1] Key Laboratory of Specially Functional Polymeric Materials and Related Technology, Ministry of Education, School of Materials and Engineering, East China University of Science and Technology, 200237, China

年份：2018

卷号：397

期号：1

外文期刊名：IOP Conference Series: Materials Science and Engineering

收录：EI(收录号：20183805838419)

语种：英文

外文关键词：Thermosets - Resins - Silicon - Curing - Shrinkage

摘要：The silicon-containing dipropargyl ether (SDE) is a novel class of thermosetting resins with many fascinating advantages such as high thermal stability and ablative resistance. But it also suffers from some shortcomings such as low mechanical properties of cured resin. To improve the mechanical properties and some processing problems of it, three different structural SDE were synthesized by Grignard reaction. The solubility, cure shrinkage rate, cure reaction, thermal properties and mechanical properties were studied. The results indicate that the SDE resins are dissolved in most organic solvents. The cure shrinkage rate of SDE resins are no more than 1.5%. The initial temperature (Ti), peak temperature (Tp) and finish temperature (Tf) are more than 230°C, 280°C and 310°C. The temperature at 5% mass loss (Td5) and residual yield at 800°C (Yr 800°C) in nitrogen are over 410°C and 68%. Flexural strength of resins is over 12 MPa. The SDE resin is promising to be an excellent thermosetting resin. ? Published under licence by IOP Publishing Ltd.