文献类型：期刊文献

英文题名：Solid-based CAPP for surface micromachined MEMS devices

作者：Li, Jianhua[1,2]; Gao, Shuming[1]; Liu, Yusheng[1]

机构：[1]Zhejiang Univ, Dept Comp Sci, State Key Lab CAD&CG, Hangzhou 310027, Peoples R China;[2]E China Univ Sci & Technol, Dept Comp Sci & Engn, Shanghai 200237, Peoples R China

年份：2007

卷号：39

期号：3

起止页码：190

外文期刊名：COMPUTER-AIDED DESIGN

收录：;EI(收录号：20071110479493);WOS:【SCI-EXPANDED(收录号:WOS:000245772500003)】；

语种：英文

外文关键词：CAPP; solid model; MEMS; CAD

摘要：Process planning for a MEMS device is almost always conducted manually by the designer to date. As the structures of MEMS devices become more and more complicated, in order to release the designers from the hard and tedious work and speed up the development of MEMS products, such a situation should be changed. In this study, a solid based CAPP method for surface micromachined MEMS device is presented. With this method, a MEMS device is designed with a traditional CAD system, and its process planning is conducted automatically based on the solid model created. The process features with engineering semantics are extracted first. Then, the process layer model is constructed with each process layer of the model being coincident with the fabrication layer of surface micromachining. Finally, the masks are synthesized and the fabrication process is generated. Furthermore, to guarantee the manufacturability of the designed MEMS device, a systematic evaluation method is proposed. The proposed design and CAPP methods enable designers to concentrate on functional and shape design of MEMS devices. (c) 2006 Elsevier Ltd. All rights reserved.