详细信息

高阻尼微胶囊/环氧树脂复合材料的制备及性能    

Preparation and Properties of High Damping Microcapsule/Epoxy Composite

文献类型:期刊文献

中文题名:高阻尼微胶囊/环氧树脂复合材料的制备及性能

英文题名:Preparation and Properties of High Damping Microcapsule/Epoxy Composite

作者:范传杰[1];周晓东[1]

机构:[1]华东理工大学化学工程联合国家重点实验室,上海200237

年份:2010

卷号:38

期号:8

起止页码:52

中文期刊名:塑料科技

外文期刊名:Plastics Science and Technology

收录:CSTPCD;;北大核心:【北大核心2008】;

语种:中文

中文关键词:环氧树脂;阻尼性能;微胶囊;力学性能

外文关键词:Epoxy; Damping properties; Microcapsule; Mechanical properties

摘要:以不同含量和粒径的微胶囊制备了微胶囊/环氧树脂复合材料,采用动态力学热分析仪,通过双悬臂梁测试方法在变温(-40~150℃)和变频(1~200Hz)条件下对其阻尼性能进行了研究。结果表明:微胶囊含量、粒径以及囊芯液体的黏度对复合材料的阻尼性能有显著影响。在相同含量下,随着微胶囊粒径和囊芯液体黏度的增大,复合材料阻尼性能不断提高。微胶囊的加入提高了复合材料低频下的阻尼性能。
A series of epoxy composites filled with microcapsules of different content and particle size were prepared.The damping properties of microcapsule/epoxy composites at -40~150℃ and 1~200 Hz were investigated by DMA.The results show that the content and particle size of microcapsule as well as viscosity of microcapsule core solvent have obvious effects on damping properties of the composites;the damping properties of the composites are improved with the increase of particle size of microcapsule and viscosity of microcapsule core solvent for the same microcapsule content;the addition of microcapsule improves the damping properties of the composites at low frequency.

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