文献类型：专利

英文题名：New boron-silicon-alkyne compound useful as high temperature resistant resin or composite material resin base, or insulating material and ceramic precursor used in fields of, e.g. electronics

作者：CHEN M;NI L;WANG G;ZHOU Q

机构：[1]UNIV EAST CHINA SCI&TECHNOLOGY

申请号：CN102226000-B

公开日：2012-11-14

语种：英文

收录：DERWENT

摘要：NOVELTY - Boron-silicon-alkyne compound (I) is new. USE - New boron-silicon-alkyne compound used as high temperature resistant resin, composite material resin base, or insulating material and ceramic precursor used in fields of electronics, information, national defense, and aerospace. ADVANTAGE - The compound has regulated performance. It has easily obtained raw materials and simple and easy production process. It can be faint yellow liquid with low viscosity or thick solid which is easy to be dissolved in normal organic solvent. DETAILED DESCRIPTION - Boron-silicon-alkyne compound of formula (-(SiR1R2-CC-Ar'-CC)x(BPh-CC-Ar'CC)y-)n (I) is new. R1, R2=H, alkyl, or aryl; x, y=integers;and Ar'=phenyl group of formula (1a) or (1b). An INDEPENDENT CLAIM is included for preparation of compound (I).