文献类型：期刊文献

英文题名：Self-Supporting Microchannel Liquid-Cooled Plate for T/R Modules Based on Additive Manufacturing: Study on Its Pass Design, Formation Process and Boiling Heat Transfer Performance

作者：Qian, Bo[1];Fan, Hongri[1];Liu, Gang[1];Zhang, Jianrui[2];Li, Pei[2]

机构：[1]Shanghai Univ Engn Sci, Sch Mech & Automot Engn, Shanghai 201620, Peoples R China;[2]East China Univ Sci & Technol, Sch Mech & Power Engn, Shanghai 200237, Peoples R China

年份：2021

卷号：11

期号：11

外文期刊名：METALS

收录：;WOS:【SCI-EXPANDED(收录号:WOS:000807202400001)】；

基金：This study was funded by the Key Project of Chinese National Programs for Fundamental Research and Development- Model Processing and Process Planning Software Project for Additive Manufacturing (2018YFB1105300)- Universal Full-dimension Digital Model Project (2018YFB1105301) and National Natural Science Foundation of China (51705307), Open Project Program of the State Key Lab of CAD&CG (Grant No. A2015).

语种：英文

外文关键词：transmit; receive (T; R) module; laser-based powder bed fusion (L-PBF); microchannel structure; boiling heat transfer; additive manufacturing

摘要：The additive manufacturing technology of laser-based powder bed fusion (L-PBF), which is used to produce boiling heat transfer structures, offers a high processing flexibility and can provide lattice structures with a high surface-to-volume ratio. As an important part of the phased array radar, the plentiful transmit/receive (T/R) modules can generate considerable heat. Targeting this local overheating problem, this study discusses the pass design, the optimal formation process, and boiling heat transfer performance of microchannel liquid-cooled plates based on L-PBF additive manufacturing technology. The optimum design and process parameters were obtained by performing basic channel experiments. On this basis, the design and formation experiments of the microchannel structure were performed, and then the porosity and pore morphology of microchannel liquid-cooled plate samples were analysed. The boiling heat transfer experiments were conducted with deionised water, and the boiling heat transfer characteristics were compared with the saturated boiling curve of a traditional copper-tube liquid-cooled plate. The average wall temperature of the designed samples decreased by 4% compared with that of the traditional liquid-cooled plate under the same heat flow density the value reduced from 111.9 degrees C to 108.2 degrees C. Furthermore, within the same optimal boiling temperature range, the average heat flow densities of all the prepared samples increased by >60% compared with those of the traditional liquid-cooled plate the value increased from minimum 16 W center dot cm(-2) to maximum 34 W center dot cm(-2). The self-supporting microchannel structure can considerably improve the heat dissipation effect of T/R modules and solve the local overheating problem.