文献类型：期刊文献

英文题名：Improved properties of PTFE composites filled with glass fiber modified by sol-gel method

作者：Li, Qiuying[1];Liu, Pengying[1];Mahmood, Kashif[1];Zhang, Ning[1];Che, Yanchao[2]

机构：[1]East China Univ Sci & Technol, Sch Mat Sci & Engn, 130 Meilong Rd, Shanghai 200237, Peoples R China;[2]Shanxi Funuoou New Mat Technol Co Ltd, Econ Dev Zone, Jinzhong 030600, Peoples R China

年份：2021

卷号：32

期号：18

起止页码：23090

外文期刊名：JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

收录：;EI(收录号：20213510828286);WOS:【SCI-EXPANDED(收录号:WOS:000688377400010)】；

语种：英文

外文关键词：Dielectric losses - Dielectric materials - Thermal conductivity - Contact angle - Glass fibers - Sols - Printed circuit boards - Thermal expansion - Dielectric properties of solids - Polydimethylsiloxane - Substrates - Bending strength

摘要：PTFE/GF(glass fiber) composites are widely applied in high-frequency printed circuit board (PCB) substrate materials due to the excellent dielectric properties of PTFE and the low thermal expansion coefficient of GF. However, the poor interface compatibility between PTFE and GF affects the performance of the composite substrates. In this study, tetraethyl orthosilicate (TEOS) was used as the silicon source, and polydimethylsiloxane (PDMS) was the organic precursor to modify the surface of GF through the sol-gel method to promote the interface compatibility of GF and PTFE. The modified GF noted T-GF was filled in PTFE to prepare PTFE/T-GF composites. SEM, FTIR, XPS, and contact angle confirmed that organic-inorganic hybrids were successfully loaded on GF's surface. Moreover, compared with PTFE/GF and the conventional coupling agent modified GF filled PTFE composites, the PTFE/T-GF exhibited improved dielectric constant (2.305), decreased dielectric loss (9.08E(-4)), higher bending strength (21.45 MPa) and bending modulus (522 MPa), better thermal conductivity (0.268 W/m*K) and lower CTE (70 ppm/degrees C), making it has promising application as the substrate materials for high frequency PCB.