详细信息

Re-entrainment mechanism of submicron particles during electrostatic capture process  ( SCI-EXPANDED收录 EI收录)  

文献类型:期刊文献

英文题名:Re-entrainment mechanism of submicron particles during electrostatic capture process

作者:Zhu, Yong[1];Huang, Zhenpeng[1];Tao, Shanlong[2];Chen, Jitong[1];Yang, Xiaoyong[1];Yin, Wei[1];Shangguan, Wenfeng[2];Bai, Zhishan[1]

机构:[1]East China Univ Sci & Technol, Sch Mech & Power Engn, Shanghai 200237, Peoples R China;[2]Shanghai Jiao Tong Univ, Res Ctr Combust & Environm Technol, Sch Mech Engn, Shanghai 200240, Peoples R China

年份:2025

卷号:308

外文期刊名:CHEMICAL ENGINEERING SCIENCE

收录:;EI(收录号:20250917970177);WOS:【SCI-EXPANDED(收录号:WOS:001436201300001)】;

基金:This work is supported by the National Natural Science Foundation of China (52200130, 22176123, 22225804) .

语种:英文

外文关键词:Re-entrainment mechanism; Submicron particles; Electrostatic capture; Theoretical collection length; Regression model

摘要:In this work, a controllable electric field with plate-plate structure, whose ratio between plate length and plateplate spacing can reach up to be 65 for mostly possible capture of targeted particles, is firstly established in laboratory level for investigating the re-entrainment mechanism of submicron particles. Computational fluid dynamic and response surface method are employed to analyze the distribution characteristics of multiple physical fields and the influence of various parameters on particle re-entrainment effect. Experimental results indicate that particle concentration decreases gradually, which follows three distinct stages of particle motion: the acceleration stage, linear motion stage, and re-entrainment stage. Gas velocity is identified as the most significant factor affecting particle re-entrainment, while charger current has a relatively minor effect. A reliable regression model for theoretical collection length has been developed and validated against experimental data, providing credible predictive values for the required collection length to capture most submicron particles.

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