文献类型：专利

英文题名：New high-temperature phenylacetylene sealing poly-(acetenyl-silane) used for base body resin, high-temperature resistant coating and ceramic primers

作者：ZHOU Q;NI L;WANG Z

机构：[1]UNIV EAST CHINA SCI&TECHNOLOGY

申请号：CN102010510-A

申请日：2010-10-21

公开日：2011-04-13

语种：英文

收录：DERWENT

摘要：NOVELTY - A high-temperature phenylacetylene sealing poly-(acetenyl-silane) (I) is new. USE - High-temperature phenylacetylene sealing poly-(acetenyl-silane) (I) used for base body resin, high-temperature resistant coating and ceramic primers. ADVANTAGE - The polymer utilizes easily obtained raw material, with simple technical process. The polymer can form thermosets with excellent anti-high-temperature and thermal oxidation performances by coupling reaction triggered in heat or chemic manner to form ceramic structure by further heating. DETAILED DESCRIPTION - A high-temperature phenylacetylene sealing poly-(acetenyl-silane) of formula (I), is new. R1, R2=H, alkyl and aryl;and n= greater than or equal to 1. An INDEPENDENT CLAIM is included for a preparation of polymer (I).