文献类型：期刊文献

英文题名：SiC Nanowires Bridged Graphene Aerogels with a Vertically Aligned Structure for Highly Thermal Conductive Epoxy Resin Composites and Their Mechanism

作者：Zhao, Xintong[1];Wu, Wei[1,2];Drummer, Dietmar[3];Wang, Yi[1];Cui, Sufei[1];Liu, Chao[1];Lu, Zijian[1];Li, Shuo[1];Chen, Qiming[1]

机构：[1]East China Univ Sci & Technol, Sino German Joint Res Ctr Adv Mat, Sch Mat Sci & Engn, Shanghai 200237, Peoples R China;[2]Shenzhen Res Inst ECUST, Shenzhen 518063, Peoples R China;[3]Friedrich Alexander Univ Erlangen Nuremberg, Inst Polymer Technol, D-91058 Erlangen, Germany

年份：2023

卷号：5

期号：5

起止页码：2548

外文期刊名：ACS APPLIED ELECTRONIC MATERIALS

收录：;EI(收录号：20232314194442);WOS:【SCI-EXPANDED(收录号:WOS:000984406900001)】；

基金：The work was funded by the Chinese German Centre for the Promotion of Science via the National Natural Science Foundation of China (NSFC) and Deutsche Forschungsge-meinschaft (DFG) under grant GZ1448 and by National Government Guided Special Funds for Local Science and Technology Development (Shen zhen, China) (2021Szvup041) .

语种：英文

外文关键词：graphene aerogel; thermal conductivity; SiC nanowires; phonon scattering; finite element analysis

摘要：Thermal conductive composites have a wide application in the electronic packaging field, and fabricating three-dimensional (3D) graphene aerogels by the self-assembly method is a facile way to construct thermal conductive networks in polymer composites. But those self-assembled graphene aerogels can only endow composites with a limited thermal conductivity because (1) abundant defects on RGO sheets reduce their intrinsic thermal conductivity and (2) massive edges and gaps in aerogels cause severe phonon scattering. Many works before have been done to heal the defects by high-temperature annealing, but the works of filling gaps and decreasing phonon scattering are rare. Herein, we designed a facile route to synthesize SiC nanowires on the edges of RGO sheets for connecting adjacent RGO sheets, decreasing phonon scattering, and enhancing thermal conduction efficiency in graphene aerogels. Before that, RGO/Si aerogels with vertically aligned structures were obtained by the chemical reduction method and the freeze-drying method to enhance their through-plane thermal conduction efficiency. When the initial mass ratio of GO solute/silicon powder was 5:1, HGA-5 endowed the EP composite with a high through-plane thermal conductivity of 3.59 W m-1 K-1 at a relatively low filler loading of 2.87 wt %. Finite element analysis was applied to illustrate the thermal conductive mechanism of the hybrid aerogels-filled EP composites. The EMI shielding performance of the composites was also discussed in this work.