文献类型：期刊文献

英文题名：Synthesis of coplanar quaternary ammonium salts with excellent electrochemical properties based on an anthraquinone skeleton and their application in copper plating

作者：Li, Xuyang[1,2];Yin, Xinpeng[1,2];Li, Jun[1,2];Yuan, Bo[1,2];Xiang, Chunyu[1,2];Zou, Peikun[1,2];Wang, Limin[1,2,3]

机构：[1]East China Univ Sci & Technol, Sch Chem & Mol Engn, Shanghai Key Lab Funct Mat Chem, 130 Meilong Rd, Shanghai 200237, Peoples R China;[2]East China Univ Sci & Technol, Sch Chem & Mol Engn, Inst Fine Chem, 130 Meilong Rd, Shanghai 200237, Peoples R China;[3]Chinese Acad Sci, Shanghai Inst Organ Chem, Key Lab Organofluorine Chem, 345 Lingling Rd, Shanghai 200032, Peoples R China

年份：2023

卷号：437

外文期刊名：ELECTROCHIMICA ACTA

收录：;EI(收录号：20224713151828);WOS:【SCI-EXPANDED(收录号:WOS:000928310100002)】；

基金：This research was financially supported by the National Natural Science Foundation of China (21772039, 21272069) , and we gratefully acknowledge financial support from the Central Universities and Key Laboratory of Organofluorine Chemistry, Shanghai Institute of Organic Chemistry, Chinese Academy of Sciences. Support from the Chinese Scholarship Council is also acknowledged.

语种：英文

外文关键词：Anthraquinone; Electrochemistry; Leveler; Copper electrodeposition

摘要：Through-hole copper deposition technology for nano-micro hole printed circuit boards (PCBs) is of great importance in the electronic industry. Achieving efficient copper electrodeposition using trace amounts of plating additives is a very challenging problem. Here, four anthraquinone (AQS) quaternary ammonium salts have been synthesised based on anthraquinone yellow pigments. These four compounds were functionalised for the first time as promising levelers for through-hole copper electrodeposition. Electrochemical tests, theoretical calculations and Molecular dynamics simulation demonstrate that the AQS-Qnl compounds have the most excellent copper deposition inhibition and electrode adsorption capacity among the four compounds. TP value measurement, SEM, XRD tests confirmed that AQS-Qnl can actually have high through-hole filling and excellent levelling performance in practical PCB plating. Based on this, The levelling mechanism of AQS-Qnl leveler was analysed by using electrostatic potential, average local ionisation energy and polarisation rate and the mechanism of AQS-Qnl's interaction with PEG and SPS in practical plating was proposed using galvanostatic measurements.