详细信息
The synergistic effect between nano-Cu lubricating additives and electroless deposited Ni-W-P coating ( EI收录)
文献类型:会议论文
英文题名:The synergistic effect between nano-Cu lubricating additives and electroless deposited Ni-W-P coating
作者:Chen, M.[1]; Cheng, W.S.[1]; Zhao, Z.X.[2]; Huang, X.B.[1]
机构:[1] College of Mechanical Engineering, Shanghai University of Engineering Science, Shanghai, China; [2] Schools of Mechanical and Power Engineering, East China University of Science and Technology, Shanghai, China
会议论文集:Proceedings - 2010 WASE International Conference on Information Engineering, ICIE 2010
语种:英文
外文关键词:Surface reactions - Heat resistance - Spectrometers - Tribology - Heat treatment - Coatings - Nickel alloys - Wear resistance - Additives
摘要:The tribological properties of nano-Cu lubricating additives and electroless deposited Ni-W-P coating as well as their synergistic effect are researched using ring-block abrasion testing machine and Energy Dispersive Spectrometer. Research results show that the wear resistance of Ni-W-P alloy coating after heat treatment at 400°C has greatly increased since the Second Phase Ni3P particles were educed. In the friction process, nano-Cu in the lubricating additives deposited on the friction surface of Ni-W-P alloy coating so as to form a protective lubricating film, therefore the antiwear and friction reducing effects are achieved by the micro polishing effect, the load effect of micro ball bearing, the filling and repairing effects and formation of the chemical reaction film on the friction surface. Experiment results confirm that Ni-W-P alloy coating and nano-Cu lubricating additive have excellent synergistic effect, and form double protection for the metal substrate, e.g., the wear resistance of Ni-W-P alloy coating (with heat treatment and the oil with nano-Cu additives) has increased hundreds times than 45 steel as the metal substrate with the basic oil, zero wear is achieved, which break through the bottleneck of previous separate research of the above-mentioned the two. ? 2010 IEEE.
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