文献类型：期刊文献

英文题名：Preparation and characterization of STRG/PI composite films with optimized dielectric and mechanical properties

作者：Zhang, Pengtu[1];He, Jianjie[1];Cui, Zhong-Kai[2];Li, Xinxin[1];Liu, Xiaoyun[1];Zhang, Shuo[3];Zhuang, Qixin[1];Han, Zhewen[1]

机构：[1]E China Univ Sci & Technol, Sch Mat Sci & Engn, Minist Educ, Key Lab Specially Funct Polymer Mat & Related Tec, Shanghai 200237, Peoples R China;[2]Univ Montreal, Dept Chem, Montreal, PQ H3C 3J7, Canada;[3]Univ Akron, Coll Polymer Sci & Polymer Engn, Dept Polymer Sci, Akron, OH 44325 USA

年份：2015

卷号：65

起止页码：262

外文期刊名：POLYMER

收录：;EI(收录号：20152000843251);WOS:【SCI-EXPANDED(收录号:WOS:000355064000030)】；

基金：The authors express their gratitude to the Basic Innovation Research Program of Science, Technology Commission of Shanghai Municipality (13JC1402002) for their financial support. This project is also supported by Shanghai Natural Science Foundation (12ZR1407900), and China Scholarship Council.

语种：英文

外文关键词：STRG; Polyimide; Dielectric property

摘要：Polymer-based high dielectric composites have attracted considerable research attention due to their unique advantages in electronic applications. Polyimide (PI) is a class of high-performance polymers with improved heat-resistance and mechanical properties owing to its aromatic and heteroatomic functionalities, yielding an ideal material for high-temperature applications. In this paper, STRG (solvothermally reduced graphene oxide) was prepared and introduced into PI matrix by solution blending, and the dielectric, mechanical and thermal properties of these STRG/PI composites were studied. The STRG/PI composite (1 wt%) witnessed a significant increase by a factor of 23 in dielectric constant (71 at 10(3) Hz), compared to neat PI. In addition, the tensile strength of STRG/PI composites was improved by 105%. This study demonstrated a promising strategic approach to fabricate STRG/PI composites with enhanced dielectric and mechanical properties, serving potential candidates for high-temperature and high-dielectric applications. (C) 2015 Elsevier Ltd. All rights reserved.