详细信息
基于Ni/高熵合金复合中间层调控FGH98高温合金与DD5单晶的界面互扩散行为以实现高性能连接 ( SCI-EXPANDED收录 EI收录)
Robust joining of FGH98 superalloy to DD5 single crystal by modulating interdiffusion behavior with Ni/high-entropy alloy hybrid interlayer
文献类型:期刊文献
中文题名:基于Ni/高熵合金复合中间层调控FGH98高温合金与DD5单晶的界面互扩散行为以实现高性能连接
英文题名:Robust joining of FGH98 superalloy to DD5 single crystal by modulating interdiffusion behavior with Ni/high-entropy alloy hybrid interlayer
作者:石俊秒[1];郭海龙[2];金峰[3];孙现军[3];王倩[4];田富强[1];李京龙[3];杨瑾[5];麻宁绪[4]
机构:[1]East China Univ Sci & Technol, Key Lab Pressure Syst & Safety, Minist Educ, Shanghai 200237, Peoples R China;[2]Aecc Hunan Aviat Powerplant Res Inst, Zhuzhou 412002, Peoples R China;[3]Northwestern Polytech Univ, Shaanxi Key Lab Frict Welding Technol, Xian 710072, Peoples R China;[4]Osaka Univ, Joining & Welding Res Inst, Mihogaoka 11-1, Ibaraki, Osaka 5670047, Japan;[5]Shanghai Univ Engn Sci, Sch Mat Engn, Shanghai 201620, Peoples R China
年份:2023
卷号:66
期号:12
起止页码:4875
中文期刊名:Science China Materials
外文期刊名:中国科学(材料科学)(英文版)
收录:CSTPCD;;EI(收录号:20234915160553);Scopus;WOS:【SCI-EXPANDED(收录号:WOS:001113631200002)】;CSCD:【CSCD2023_2024】;PubMed;
基金:This work was financially supported by the National Natural Science Foundation of China (52005410 and 52375146), China Postdoctoral Science Foundation (2019TQ0263 and 2020M683560), and the Fundamental Research Funds for the Central Universities.
语种:中文
中文关键词:FGH98 superalloy;DD5 single crystal;high-entropy alloy;interdiffusion;performance
外文关键词:FGH98 superalloy; DD5 single crystal; high-entropy alloy; interdiffusion; performance
摘要:FGH98高温合金和DD5单晶有望在高温环境中服役.在本研究中,我们采用Ni/高熵合金(Ni/HEA)复合中间层实现了FGH98与DD5的高性能扩散连接.FGH98高温合金、DD5单晶和Ni/HEA复合中间层间元素互扩散导致焊缝处形成细小Ni3Al相(γ′)增强FCC固溶体的复合组织,实现了高强度界面结合.温度是影响界面元素扩散的关键参量.当焊接温度从1075℃提高至1130℃时,界面处元素扩散剧烈,促进了界面空隙闭合和复合扩散区增厚,有利于接头性能提升.然而,过高的扩散温度(1160℃)导致FGH98高温合金和HEA层中形成粗晶组织及化合物相,使接头性能恶化.FGH98-DD5连接体系最优工艺参数为:焊接温度为1130℃、焊接压力为2 MPa、焊接时间为1 h.接头最高抗剪强度为650 MPa,剪切过程中接头表现为韧性断裂.该研究可为界面元素扩散调控提供科学借鉴,也为FGH98高温合金与DD5单晶的可靠连接提供了理论和技术支持.
FGH98 superalloys and DD5 single crystals are highly desired to work together in high-temperature service environments.In this study,the FGH98-DD5 robust joining was enabled by diffusion bonding using a hybrid interlayer of Ni and high-entropy alloy(Ni/HEA).Elemental interdiffusion among the FGH98 superalloy,DD5 single crystal,and Ni/HEA hybrid interlayer triggered the formation of individual tiny Ni3Al phase(γ?)-reinforced face-centered cubic(FCC)matrix composite structures,resulting in the high-strength interfacial bonding.Temperature plays a key role in regulating the elemental interdiffusion.As the temperature required for diffusion bonding increased from 1075 to 1130°C,the elemental interdiffusion intensified to promote the void closure at interfaces and the thickening of composite diffusion zones(γ?-reinforced FCC matrix composites),which favors joint strengthening.Nevertheless,the too-high diffusion temperature(1160°C)led to the formation of coarse grains and additional carbides in the FGH98 superalloy and HEA layer,deteriorating the joint performance.Ultimately,the optimal diffusion bonding condition was identified as 1130°C for 1 h with a low pressure of 2 MPa under vacuum,in which the FGH98-DD5 joint underwent a ductile fracture with a shear strength of up to 650 MPa.This study provides scientific insight for modulating interdiffusion behavior,as well as theoretical and technical support for joining FGH98 superalloys reliably with DD5 single crystals.
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