详细信息

聚(间二乙炔基苯-甲基氢硅烷)/含乙炔基苯并噁嗪树脂共混体系固化行为及其耐热性能研究    

Curing behavior and heat resistance of poly (m-diethynylbenzene-methylsilane)/acetylene-functional benzoxazine blended resins

文献类型:期刊文献

中文题名:聚(间二乙炔基苯-甲基氢硅烷)/含乙炔基苯并噁嗪树脂共混体系固化行为及其耐热性能研究

英文题名:Curing behavior and heat resistance of poly (m-diethynylbenzene-methylsilane)/acetylene-functional benzoxazine blended resins

作者:卢丹[1];束长朋[1];周权[1];宋宁[1];倪礼忠[1]

机构:[1]华东理工大学材料科学与工程学院特种功能高分子材料及相关技术教育部重点实验室,上海200237

年份:2019

卷号:46

期号:3

起止页码:54

中文期刊名:北京化工大学学报(自然科学版)

外文期刊名:Journal of Beijing University of Chemical Technology(Natural Science Edition)

收录:CSTPCD;;Scopus;北大核心:【北大核心2017】;CSCD:【CSCD_E2019_2020】;

基金:国家自然科学基金(51573044)

语种:中文

中文关键词:聚(间二乙炔基苯-甲基氢硅烷);含乙炔基苯并噁嗪树脂;固化行为;耐高温

外文关键词:poly(m-diethynylbenzene-methylsilane);acetylene-functionalized benzoxazine;curing behavior;high temperature resistance

摘要:聚(间二乙炔基苯-甲基氢硅烷)(PSA)和含乙炔基苯并噁嗪树脂(A-PBZ)在热作用下均能够聚合形成交联网状结构。研究了PSA/A-PBZ共混树脂(SB)的固化行为。通过红外光谱(FT-IR)、旋转流变仪和差示扫描量热仪(DSC)研究了PSA/A-PBZ质量比为5∶2时共混树脂(SB-2)的固化特性,利用动态DSC分析,根据Kissinger方法和Ozawa方法计算得出SB-2共混树脂固化反应的表观活化能分别为108.4 kJ/mol、111.1 kJ/mol,反应级数分别为0.93和0.95,固化反应遵循一级反应机理。同时还对SB共混树脂体系的耐热性能进行了探究,热重分析(TGA)结果表明:在氮气和空气氛围下,SB共混树脂固化物失重5%的温度(T_(d5))和1 000℃时的质量保留率均随着A-PBZ树脂加入量的增加而减小,但SB共混树脂仍然表现出优异的耐热性能。
Poly (m-diethynylbenzene-methylsilane)(PSA) and acetylene-functionalized benzoxazine resin (A- PBZ) have been thermally co-polymerized to form a cross-linked structure. The curing behavior of the PSA/ A-PBZ blended resins (SB) was studied. The curing properties of the SB-2 blending resins were studied by FT-IR, rheo- logical analysis and DSC. Dynamic DSC analysis gave a value of the apparent activation energy for the curing reac-tion of the SB-2 blending resin of about 108kJ/mol (using the Kissinger method) and 111kJ/mol (using the Oza- wa method) and the calculated reaction orders were 0.93 and 0.95, respectively. The curing reaction follows first- order kinetics. The heat resistance of the SB blended resin was also studied. TGA in nitrogen and air showed that the temperature for 5% mass loss (Td5) and the residual mass at 1000℃ decreased with increasing content of A-PBZ resin, but the SB blended resin still exhibited excellent heat resistance.

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