文献类型：期刊文献

英文题名：Preparation of long-chain branched polyarylate foam with low dielectric and superior flame retardant performance by supercritical CO2 foaming

作者：Sun, Jiayang[1];Zhong, Wenyu[1];Chen, Yichong[1,2];Yu, Jiabao[1];Xi, Zhenhao[1];Li, Jinjin[1];Hu, Dongdong[1];Chen, Bojiang[1];Shi, Zhilu[1];Zhao, Ling[1,2]

机构：[1]East China Univ Sci & Technol, Sch Chem Engn, State Key Lab Chem Engn, Shanghai Key Lab Multiphase Mat Chem Engn, Shanghai 200237, Peoples R China;[2]East China Univ Sci & Technol, Shanghai Elect Chem Innovat Inst, Shanghai 201419, Peoples R China

年份：2025

卷号：225

外文期刊名：JOURNAL OF SUPERCRITICAL FLUIDS

收录：;EI(收录号：20252418605219);WOS:【SCI-EXPANDED(收录号:WOS:001509800700001)】；

基金：This work was supported by the National Natural Science Foundation of China (grant no. 22308097) , the Shanghai Post-doctoral Excellence Program (grant no. 2022765) , the National Key Research and Devel-opment Program of China (grant no. 2016YFB0302200) , the Funda-mental Research Funds for the Central Universities (grant no. JKA012011002) , and the 111 Project (grant no. B20031) .

语种：英文

外文关键词：High-frequency transmission; Long-chain branched modification; Polyarylate; Supercritical CO2 foaming

摘要：The rapid advancement of high-frequency, high-speed communication has increased the demand for electronic components with low dielectric properties and excellent stability. This study focuses on polyarylate (PAR), an engineering plastic, selected as a matrix material. To improve its properties, ADR, a long-chain branched modifier, was used to enhance rheological, mechanical, and foaming behavior. Supercritical CO2 was employed as a foaming agent, producing long-chain branched PAR foams. The results showed significant improvements in foaming performance, with a foam density of 0.364 g/cm3 and small, well-arranged cells (10 mu m). Characterization revealed that the foam possesses outstanding mechanical properties, excellent low dielectric loss (0.00217), low water absorption, and superior flame retardancy, making it a promising substrate material for high-frequency, high-speed communication applications.