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3-D thermodynamic analysis on wetting behavior of superhydrophobic surfaces  ( SCI-EXPANDED收录 EI收录)  

文献类型:期刊文献

英文题名:3-D thermodynamic analysis on wetting behavior of superhydrophobic surfaces

作者:He, Liang[1];Liang, Wenyan[1];Wang, Zhenqing[1];Yang, Bin[2];Duan, Zhiwei[1];Chen, Yahui[1]

机构:[1]Harbin Engn Univ, Coll Aerosp & Civil Engn, Harbin, Peoples R China;[2]East China Univ Sci & Technol, Sch Mech & Power Engn, Shanghai, Peoples R China

年份:2016

卷号:504

起止页码:201

外文期刊名:COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS

收录:;EI(收录号:20162402479100);WOS:【SCI-EXPANDED(收录号:WOS:000379836100022)】;

基金:This work was supported by the State Key Program of National Natural Science of China (Grant No. 11532013); National Natural Science Foundation of China (Grant No. 11302054); Natural Science Foundation of Heilongjiang Province of China (Grant No. A2015012).

语种:英文

外文关键词:Superhydrophobic; Contact angle; Thermodynamic analysis; Free energy barrier

摘要:Superhydrophobic surfaces have attracted much interest from experimental researches due to their special properties. Various researches to prepare these surfaces have been reported. However, the thermodynamic mechanisms of superhydrophobicity affected by surface roughness have not been understood completely. In this paper, a 3-D square pillar-textured surface model is chosen to investigate the thermodynamic mechanism responsible for contact angle (CA), contact angle hysteresis (CAH) and free energy barrier (FEB). The effects of pillar height on CA, CAH and FEB, as well as the transition between non composite and composite states are obtained, and the calculated results are essentially consistent with the results of theoretical calculations and experimental investigations. Additionally, the scope of application of the 3-D models is further extended to any pillar-textured surfaces with arbitrary shaped cross-sections. The present approach could provide a theoretical guidance for designing superhydrophobic surfaces. (C) 2016 Elsevier B.V. All rights reserved.

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