详细信息
聚酰胺6/短切碳纤维/铜盐复合材料抗热氧老化机理的研究
Study on Anti-thermal Oxidative Aging Mechanism of Polyamide 6/Short-cut Carbon Fiber/Copper Salt Composites
文献类型:期刊文献
中文题名:聚酰胺6/短切碳纤维/铜盐复合材料抗热氧老化机理的研究
英文题名:Study on Anti-thermal Oxidative Aging Mechanism of Polyamide 6/Short-cut Carbon Fiber/Copper Salt Composites
作者:刘耀[1];丁剑峰[1];夏浙安[1];李欣欣[1]
机构:[1]华东理工大学材料科学与工程学院,特种功能高分子材料及相关技术教育部重点实验室,上海200237
年份:2021
卷号:35
期号:7
起止页码:12
中文期刊名:中国塑料
外文期刊名:China Plastics
收录:CSTPCD;;Scopus;北大核心:【北大核心2020】;CSCD:【CSCD2021_2022】;
基金:中央高校基本科研业务费专项资金资助项目(50321042017001)。
语种:中文
中文关键词:抗热氧老化;聚酰胺6;铜盐;碘化钾;配位离子;碳纤维
外文关键词:resistance to thermal-oxidative aging;polyamide 6;copper salt;potassium iodide;coordination ion;carbon fiber
摘要:采用熔融共混法制备了聚酰胺6(PA6)/短切碳纤维(SCF)/铜盐/碘化钾(KI)复合材料,通过电子万能试验机、差示扫描量热分析仪(DSC)、X射线多晶衍射仪(XRD)和X射线光电子能谱仪(XPS)等研究了铜盐/KI体系对聚酰胺材料力学性能及热氧老化行为的影响,并分析探讨了材料耐热氧老化的作用机理。结果表明,单一铜盐或KI对PA6的抗热氧老化作用不大,而铜盐/KI复配体系可以有效提高PA6/SCF耐热老化后的拉伸强度保持率;SCF有一定的自由基捕捉能力,铜盐/KI/SCF的加入显著延长了PA6的氧化诱导时间(OIT);铜盐/KI体系的抗热氧老化机理为:首先KI使聚酰胺基体中的二价铜转化为一价铜,然后过量KI与一价铜反应生成二碘合铜配离子[CuI2]-,[CuI2]-离子具有较强还原性,能够消耗聚酰胺老化过程中产生的自由基,从而延缓了聚酰胺6的热降解过程。
Polyamide 6(PA6)/short-cut carbon fiber(SCF)/copper salt/potassium(KI)composites were prepared using a melt blending method. The heat-resistant oxidative aging mechanisms of copper salt/KI system for the PA6 composites were studied using electronic universal testing machine,differential scanning calorimetry(DSC),X-ray polycrystalline diffractometer(XRD)and X-ray photoelectron spectrometer(XPS). The results indicated that there is little effect from a single copper salt or KI on the thermal-oxidative aging resistance of PA6. The copper salt/KI compounding system can effectively improve the retention rate of tensile strength for the PA6/SCF composites after heat aging. The carbon fiber has a certain capability to capture free radicals. The addition of copper salt,KI and SCF significantly prolonged the oxidation induction time of PA6. The anti-thermal oxidative aging mechanism of the copper salt/KI system is proposed as follows:firstly,KI converts the divalent copper in the polyamide matrix into monovalent copper,then excessive KI can react with monovalent copper to form Cupric diiodide ion[CuI2]-. [CuI2]-ions have strong reducibility,which consumes free radicals generated during the aging process of PA6,delaying the thermal degradation process of PA6 accordingly.
参考文献:
正在载入数据...
