文献类型：期刊文献

中文题名：焊球正六边形排布倒装芯片的下填充毛细压研究

英文题名：Study of the Capillary Pressure of Flip-Chip Underfill with Hexagonal Solder Bump Arrangement

作者：方俊杰[1];姚兴军[1];杨家辉[1]

机构：[1]华东理工大学机械与动力工程学院,上海200237

年份：2017

卷号：42

期号：12

起止页码：938

中文期刊名：半导体技术

外文期刊名：Semiconductor Technology

收录：北大核心:【北大核心2014】；CSCD:【CSCD_E2017_2018】；

基金：上海市自然科学基金资助项目(15ZR1409300)

语种：中文

中文关键词：倒装芯片;下填充;焊球排布;毛细压;六边形

外文关键词：flip-chip; underfill; solder bump arrangement; capillary pressure; hexagon

摘要：除了正四边形,正六边形也是倒装芯片中可行的焊球排布形式,为了预测封装倒装芯片时的下填充过程,需要精确计算毛细驱动压。在已有的焊球正四边形排布情况下平均毛细压计算方法的基础上,进一步研究了焊球正六边形排布情况下平均毛细压计算模型。通过分阶段处理,并根据质量守恒和力平衡的原则,分析了下填充过程,重点分析了填充面积和接触线跳跃量的计算,进而得到了计算平均毛细压的数学模型。通过实例验证了该模型的准确性,从而完善了倒装芯片封装工艺中的下填充流动解析模型。
Besides quadrilateral,hexagon is another feasible solder bump arrangement in flip chip.To predict the underfilling process in flip-chip package,capillary driven pressure need to be calculated precisely.Based on the existing calculating method of the average capillary pressure in quadrilateral bump arrangement,the calculated model of the average capillary pressure in hexagonal arrangement was further studied.Through stages processing,according to the conservation of mass and the principle of force balance,the underfilling process was analyzed,the filling area and the contact line jump value were analyzed,and the mathematical model for calculating the average capillary pressure was obtained.The accuracy of the model was verified by the numerical simulation,the analytic model of the underfilling flow in flip-chip packaging process was improved.