详细信息

Copolymer of eugenol-based and pyrogallol-based benzoxazines: Low curing temperature and enhanced corrosion resistance  ( SCI-EXPANDED收录 EI收录)  

文献类型:期刊文献

英文题名:Copolymer of eugenol-based and pyrogallol-based benzoxazines: Low curing temperature and enhanced corrosion resistance

作者:Chen, Chen[1];Cao, Yuzhu[1];Lu, Xin[1];Li, Xiu[1];Yao, Hongjie[1];Xin, Zhong[1]

机构:[1]East China Univ Sci & Technol, Sch Chem Engn, Dept Prod Engn, Shanghai Key Lab Multiphase Mat Chem Engn, Shanghai 200237, Peoples R China

年份:2021

卷号:609

外文期刊名:COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS

收录:;EI(收录号:20204109332901);WOS:【SCI-EXPANDED(收录号:WOS:000598937100008)】;

基金:This work was financially supported by National Natural Science Foundation of China (21776080) and Innovation Program of Shanghai Municipal Education Commission (2019-01-07-00-02-E00061).

语种:英文

外文关键词:Bio-based benzoxazine; Copolymerization; Curing temperature; Anti-corrosion

摘要:In this work, eugenol/stearylamine-based benzoxazine (E-s) and pyrogallol/furfurylamine-based benzoxazine (PY-f) were synthesized from renewable raw materials and mixed to prepare a series of copolymers. The curing behavior of E-s/PY-f mixtures were characterized by differential scanning calorimetry (DSC). The result shows that the curing temperature decreased obviously with the increase of PY-f content. When the mass ratio of E-s to PY-f was 8:2, the exothermic peak temperature (Tp) of the sample (EP20) dropped to 194 degrees C, which was 70 degrees C lower than that of E-s. Then, the representative copolymerization mechanism of E-s and PY-f was proposed. Furthermore, EP20 was adopted to prepare the copolymer coating (PEP) on mild steel (MS) for anti-corrosion application. The results of electrochemical impedance spectroscopy (EIS) indicated that PEP-coated MS well kept its corrosion resistance after being immersed in 3.5 wt% NaCl aqueous solution for 30 days. Hence, the copolymer of bio-based benzoxazines is promising for preparing superior anti-corrosion material with low curing temperature.

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