文献类型：期刊文献

英文题名：An Analytical Model for Permeability of Underfill Flow in Flip-Chip Packaging With Consideration of the Actual Specific Surface and Tortuosity

作者：Yao, Xing Jun[1];Zhang, Wen Jun[2,3]

机构：[1]East China Univ Sci & Technol, Dept Mat & Equipment Engn, Sch Mech & Power Engn, Shanghai 200237, Peoples R China;[2]Shanghai Univ, Sch Mechatron Engn & Automat, Shanghai 200072, Peoples R China;[3]Univ Saskatchewan, Dept Mech Engn, Saskatoon, SK S7N 5A1, Canada

年份：2018

卷号：8

期号：8

起止页码：1507

外文期刊名：IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY

收录：;EI(收录号：20182805527849);WOS:【SCI-EXPANDED(收录号:WOS:000440874000020)】；

基金：This work was supported by the Natural Science Foundation of Shanghai, China, under Grant 15ZR1409300. Recommended for publication by Associate Editor E. D. Perfecto upon evaluation of reviewers' comments.

语种：英文

外文关键词：Differential element method (DEM); flip-chip packaging; permeability; porous medium; specific surface; tortuosity; underfill

摘要：Permeability is an important concept in understanding and modeling the flow or dynamic behavior of fluids in a porous medium (e.g., flip chip in electronics packaging). There are two factors (specific surface and tortuosity) that affect the permeability of a porous medium, but they are ignored by analytical models for permeability in the literature. In this paper, we present an analytical model for permeability of the underfill porous medium in flip-chip packaging by consideration of the actual specific surface and tortuosity. The proposed model and other models without consideration of the actual specific surface and tortuosity are compared with reference to a well-proven numerical model. The result of comparison has shown a significant improvement in accuracy with our model. This paper contributes not only to the underfill flip-chip package, but also to the field of porous mediums with regular arrangements of pores.