文献类型：期刊文献

英文题名：Highly thermally conductive polybenzoxazine composites based on boron nitride flakes deposited with copper particles

作者：Wang, Yi[1];Wu, Wei[1];Drummer, Dietmar[2];Liu, Chao[1];Shen, Wanting[1];Tomiak, Florian[2];Schneider, Kevin[2];Liu, Xingrong[1];Chen, Qiming[1]

机构：[1]East China Univ Sci & Technol, Sino German Joint Res Ctr Adv Mat, Sch Mat Sci & Engn, Shanghai 200237, Peoples R China;[2]Friedrich Alexander Univ Erlangen Nuremberg, Inst Polymer Technol, D-91058 Erlangen, Germany

年份：2020

卷号：191

外文期刊名：MATERIALS & DESIGN

收录：;EI(收录号：20201508412637);WOS:【SCI-EXPANDED(收录号:WOS:000536937200087)】；

基金：The work was funded by the Chinese German Centre for the Promotion of Science via the National Natural Science Foundation of China (NSFC) and Deutsche Forschungsgemeinschaft (DFG) under [grant number GZ1448].

语种：英文

外文关键词：Hybrid filler; Thermal conductivity; Contact resistance; Boron nitride; Polybenzoxazine

摘要：To solve the heat diffusion problem in electronic packaging, a novel kind of irregularly shaped hybrid filler, boron nitride@copper (BN@Cu), was successfully assembled via reduction of Cu2+. BN@Cu hybrid fillers composed of different mass ratios between BN and Cu have been prepared and characterized. A specific BN@Cu hybrid filler (mBN:mCu = 100:2), labeled as BN@2Cu, exhibited remarkable ability in enhancing the thermal conductivity of polybenzoxazine (PBz) composites fabricated through ball milling followed by hot pressing. With 25 wt% of BN@2Cu hybrid fillers, the thermal conductivity of PBz composites reaches 1.049Wm(-1) K-1. Dielectric properties, electrical conductivity, and curing behavior of the composites were also investigated. In addition, Foygel's thermal conduction model was employed to demonstrate the mechanism of BN@2Cu hybrid filler in improving thermal conductivity. (C) 2020 The Authors. Published by Elsevier Ltd.