文献类型：期刊文献

中文题名：h-BN与Al2O3复配填充共聚甲醛导热材料的制备及性能

英文题名：Preparation and Properties of Thermally Conductive Co-POM Materials Filled with Composite of h-BN and Al2O3

作者：吴唯[1];刘建华[1];刘江[1];邹志强[1];张雪薇[1]

机构：[1]华东理工大学材料科学与工程学院中德先进材料联合研究中心

年份：2019

卷号：45

期号：3

起止页码：419

中文期刊名：华东理工大学学报（自然科学版）

外文期刊名：Journal of East China University of Science and Technology

收录：CSTPCD;;Scopus;北大核心:【北大核心2017】；CSCD:【CSCD_E2019_2020】；

语种：中文

中文关键词：六方氮化硼;氧化铝;共聚甲醛;复配填充;导热性能

外文关键词：h-BN;Al2O3;Co-POM;compound filling;thermal conductivity

摘要：选用六方氮化硼(h-BN)和α球形 Al2O3为导热填料,分别以单一填料和复配填料制备填充共聚甲醛(Co-POM)导热材料,研究了填料含量、复配比例等因素对 Co-POM 材料的导热系数、拉伸性能和微观形态的影响。结果表明:两种填料都能提高 Co-POM材料的导热系数,填充量越大,导热系数越高,但 h-BN 比 Al2O3 导热改性效果更好。当 h-BN 和 Al2O3 复配填充质量比为 1∶1(填充总量的质量分数为 20%)时,Co-POM 导热系数超过 Al2O3 质量分数为30%的单一填料的导热系数,并接近 h-BN 质量分数为 20%的单一填料的导热系数,而复配填充 Co-POM 的力学性能变化不大。因此,复配填料能达到降低填充量以及降低填料成本的目的。
Copolyoxymethylene(Co-POM) material has ordered molecular structure without side-chain, and is called metallic plastic because of its good dimensional stability, mechanical properties, processability and insulation. Co-POM material is widely applied in many fields, such as electronics and electrical appliances, plumbing and irrigation equipments, automobiles. However, the application of Co-POM is limited in the fields of microelectronics and LED lighting due to its low thermal conductivity. Therefore, it is crucial to prepare the Co-POM material with high thermal conductivity and excellent mechanical properties. To this regard, we blend some thermally conductive fillers with Co-POM resin in order to improve its thermal conductivity. Hexagonal boron nitride (h-BN) and α spherical alumina (Al2O3) can be as thermally conductive filler, due to their higher thermal conductivity than Co-POM. Co-POM thermally conductive materials were prepared with single or composite fillers. The effects of filler content and composition ratio on the thermal conductivity, tensile property and micro-morphology of thermally conductive Co- POM materials were investigated in this work. The results showed that the thermal conductivity Co-POM materials could be improved by filling with h-BN or Al2O3, the more the content of filler was used, the higher thermal conductivity of filled materials was obtained. Notably, the thermally modified effect of h-BN was better than Al2O3. Furthermore, in case the mass ratio of h-BN and Al2O3 was at 1:1, the resulting thermally conductivity of Co-POM material (the mass fraction of filler was 20%, the same below) was higher than the Co-POM material prepared with 30%(mass fraction) Al2O3, and approaching to the thermal conductivity of Co-POM prepared with 20%(mass fraction) h-BN. Additionally, the tensile strength of Co-POM material filled with composite showed slight changes. Therefore, the use of composite fillers can reduce the added content of filler, and thereby decrease the cost of materials preparation.