文献类型：期刊文献

英文题名：Formation of unique three-dimensional interpenetrating network structure with a ternary composite

作者：Wang, Xiaomin[1,2];Fang, Xinliang[1,2];Liu, Xiaoyun[1,2];Pei, Qibing[3];Cui, Zhong-Kai[4];Deng, Shifeng[1,2];Gu, Jinlou[1,2];Zhuang, Qixin[1,2]

机构：[1]East China Univ Sci & Technol, Key Lab Special Funct Polymer Mat & Related Techn, Minist Educ, Shanghai 200237, Peoples R China;[2]East China Univ Sci & Technol, Sch Mat Sci & Engn, Key Lab Adv Polymer Mat Shanghai, Shanghai 200237, Peoples R China;[3]Univ Calif Los Angeles, Dept Mat Sci & Engn, Soft Mat Res Lab, Los Angeles, CA 90095 USA;[4]Univ Montreal, Dept Chem, CP 6128,Succ Ctr Ville, Montreal, PQ H3C 3J7, Canada

年份：2018

卷号：29

期号：21

起止页码：18699

外文期刊名：JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

收录：;EI(收录号：20184005891393);WOS:【SCI-EXPANDED(收录号:WOS:000446481300082)】；

基金：This work was financially supported by the National Natural Science Foundation of China (51573045, 51773060) and the International Collaboration Research Program of Science and Technology Commission of Shanghai (16520722000).

语种：英文

外文关键词：Thermodynamic stability - Composite films - Tensile strength

摘要：Ternary composite of reduced graphene oxide/multi-walled carbon nanotubes (RGO/MWCNT)/polyimide (PI) with high-performance mechanical and electrical properties was synthesized via in situ polymerization. The unique three-dimensional interpenetrating network structure conferred the conductive pathways for electrons, resulting from the strong interfacial covalent bonds between RGO/MWCNT and the PI matrix. The electrical conductivity of (RGO/MWCNT)/PI reached 4.4x10(-4) Sm-1 with the filler loading concentration at an extremely low value (0.2wt%), which was significantly higher than that of the neat PI. The (RGO/MWCNT)/PI composite films exhibited high tensile strength (up to 462MPa) and tensile modulus (260MPa). Furthermore, the introduction of RGO/MWCNT enhanced the thermal stability of the (RGO/MWCNT)/PI composites (from 579 to 623 degrees C). The composite film is expected to be extensively applied in the field of electronics, solar cells and biosensors.