文献类型：期刊文献

英文题名：Mechanism and kinetics of moisture-curing process of reactive hot melt polyurethane adhesive

作者：Sun, Li[1];Zong, Zegang[1];Xue, Weilan[1];Zeng, Zuoxiang[1]

机构：[1]East China Univ Sci & Technol, Sch Chem Engn, Shanghai 200237, Peoples R China

年份：2020

卷号：4

外文期刊名：CHEMICAL ENGINEERING JOURNAL ADVANCES

收录：WOS:【ESCI(收录号:WOS:001081004700006)】；

语种：英文

外文关键词：HMPUR; Moisture-curing; Kinetic model; Diffusion; Mechanism

摘要：Reactive hot melt polyurethane adhesive (HMPUR) was prepared by polycondensation of polyesters, pentaerythritol diacrylate (PEDA) and 4,4 ' -Methylene diphenyl diisocyanate (MDI). The moisture-curing kinetic experiments for HMPUR film with a thickness of 2.0 mm were carried out at various temperatures (283, 293, 303 and 313 K) and 85% relative humidity, with the mass changes dynamically monitored. A diffusion-reaction assumption was proposed to describe the mechanism of the moisture-curing process, and three kinetic models were established to correlate the moisture-curing kinetic data. The results showed that the model with the first-order reaction assumption is more reasonable. Based on the model, the time-dependent concentration profiles of water in HMPUR film, as well as the depth ( x * ) of water-diffusion, are predicted. Also, the reaction activation energy (Ek) and the diffusion activation energy (ED) were determined.