文献类型：期刊文献

英文题名：CuO-doped borosilicate glass fluxes for dense, low-resistivity copper films

作者：Wang, Jihong[1,2];Chen, Chunyu[1,2];Zhang, Shenrui[1,2];Wang, Wenzhi[1,2];Xu, Zhuoling[1,2];Zeng, Huidan[1,2]

机构：[1]East China Univ Sci & Technol, Sch Mat Sci & Engn, Shanghai 200237, Peoples R China;[2]East China Univ Sci & Technol, Shanghai Innovat Inst Elect Chem, Shanghai 200237, Peoples R China

年份：2026

卷号：52

期号：8

起止页码：9710

外文期刊名：CERAMICS INTERNATIONAL

收录：;EI(收录号：20260720045539);WOS:【SCI-EXPANDED(收录号:WOS:001714982900001)】；

基金：This work was supported by the National Natural Science Foundation of China (No. 52272001) and by the State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology (AWJ-23Z03) .

语种：英文

外文关键词：CuO-Doped borosilicate glass; copper paste; Wettability; MLCC termination; Liquid-phase sintering

摘要：To meet the increasing demand for multilayer ceramic capacitors (MLCCs) with higher capacitance, miniaturization, and greater reliability, advanced copper electrode materials combining high conductivity and mechanical stability are required. In this study, a CuO-doped R2O-BaO-B2O3-SiO2 glass system was developed as an inorganic flux for conductive copper pastes. Its performance was evaluated on alumina substrates and MLCC terminations. The effects on the glass network structure and properties were investigated by varying the CuO/BaO substitution ratio (0-16 mol %). Results reveal that CuO doping improves wettability, lowers sintering and hemispherical temperatures (enabling low-temperature co-firing at approximate to 820 degrees C), enhances electrical performance, and strengthens interfacial adhesion. The 12 mol % CuO composition yields optimally densified and uniform copper films, demonstrating that tailored glass formulations can enable high-performance copper electrodes at reduced processing temperatures.