文献类型：期刊文献

英文题名：Creating Single-Crystalline β-CaSiO3 for High-Performance Electronic Packaging Substrate

作者：Jia, Qingchao[1]; Wang, Wenzhi[1]; Zhang, Hujun[1]; Chen, Chunyu[1]; Li, Ao[1]; Chen, Chen[2]; Yu, Hang[2]; Zhang, Liangzhu[1]; Tao, Haizheng[3]; Zeng, Huidan[1]; Luo, Xiongke[2]; Yue, Yuanzheng[4]

机构：[1] School of Materials Science and Engineering, East China University of Science and Technology, Shanghai, 200237, China; [2] Shanghai Zenfocus Semiconductor Technology Co., Ltd., Shanghai, 201206, China; [3] State Key Laboratory of Silicate Materials for Architectures, Wuhan University of Technology, Wuhan, 430070, China; [4] Department of Chemistry and Bioscience, Aalborg University, Aalborg, DK-9220, Denmark

年份：2025

卷号：37

期号：7

外文期刊名：Advanced Materials

收录：EI(收录号：20245217580924)

语种：英文

外文关键词：Bending strength - Crystal atomic structure - Electronics packaging - Glass ceramics - Packaging materials - Polycrystalline materials - Sintering

摘要：β-CaSiO3 based glass-ceramics are among the most reliable materials for electronic packaging. However, developing a CaSiO3 glass-ceramic substrate with both high strength (>230MPa) and low dielectric constant (3 for a high-performance glass-ceramic substrate. This is accomplished by introducing Al3+ into the CaO-B2O3-SiO2 glass system, and by optimizing the sintering condition. Al3+ doping facilitates a heterogeneous network structure that energetically favors the precipitation of polycrystalline particles, including nanosized β-CaSiO3 crystals and sub-nanosized α-CaSiO3 crystals. As the sintering temperature increases, the nano α-CaSiO3 crystals (2–10nm) are gradually absorbed by the β-CaSiO3 crystals. Through atomic rearrangement, α-CaSiO3 crystals transform into micrometer-sized single crystal β-CaSiO3 (1–2μm) with layered structure. The low temperature co-fired β-CaSiO3 glass-ceramics exhibit exceptional properties, including a low dielectric constant of 4.04, a low dielectric loss of 3.15 × 10?3 at 15GHz, and a high flexural strength of 256MPa. This work provides a new strategy for fabricating high-performance single-crystalline glass-ceramics for electronic packaging and other applications. ? 2024 Wiley-VCH GmbH.