文献类型：期刊文献

英文题名：Synthesis and characterization of thermosetting polyacetylene-terminated silicone resins

作者：Liu, Zhongqi[1];Huang, Yanchun[1];Deng, Shifeng[1]

机构：[1]East China Univ Sci & Technol, Sch Mat Sci & Engn, Key Lab Specially Funct Polymer Mat & Related Tec, Minist Educ, 130 Meilong Rd, Shanghai 200237, Peoples R China

年份：2020

卷号：137

期号：23

外文期刊名：JOURNAL OF APPLIED POLYMER SCIENCE

收录：;EI(收录号：20195007824538);WOS:【SCI-EXPANDED(收录号:WOS:000500774500001)】；

基金：The authors acknowledge the Fundamental Research Funds for the Central Universities (50321041917001).

语种：英文

外文关键词：crosslinking; resins; thermogravimetric analysis; thermosets

摘要：A novel polyacetylene-terminated silicone (PTS) resins possessing low curing temperature and high heat resistance has been prepared by Grignard reaction using m-diacetylenylbenzene (DEB), 1,3,5-triacetylenylbenzene(TEB), and dichlorosilane as original materials. The reaction of the functional groups was characterized by in situ Fourier transform infrared spectrometer. The experimental results indicated that SiH and C equivalent to CH bonds are almost exclusively involved in the crosslinking reaction, while C equivalent to C bonds only partially react. Further, SiH and C equivalent to CH bonds can participate in the curing reaction at relatively low temperatures, but C equivalent to C bonds require higher temperature, indicating the higher activity of SiH and C equivalent to CH bonds than C equivalent to C bonds. As determined by differential scanning calorimetry, PTS resins have low peak exothermic temperature at 184.5 degrees C, which is lower than MSP resin (210 degrees C); in addition, rheological test showed that PTS resins have a very wide processing window from 40 to 163.3 degrees C, indicating that the PTS resins have excellent processability with a low curing temperature and wide processing window. What is more, TGA results of thermal-cured PTS resins revealed that T-d5 (5% weight loss temperature) of PTS-H10 reached the highest of 684.4 degrees C. Compared with PTS-H0 resin, there is an increase of 124.2 degrees C and the remarkably increased heat resistance correlated with a higher m-DEB input ratio. (c) 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019, 137, 48783.