详细信息

Effect of solvent on the chain conformation and cure behavior of phenolic resin  ( SCI-EXPANDED收录 EI收录)  

文献类型:期刊文献

英文题名:Effect of solvent on the chain conformation and cure behavior of phenolic resin

作者:Zhang Yan[1];Liu Yujian[1];He Qi[1];Han Zhewen[1]

机构:[1]E China Univ Sci & Technol, Sch Mat Sci & Engn, Minist Educ, Key Lab Ultrafine Mat, Shanghai 200237, Peoples R China

年份:2008

卷号:108

期号:5

起止页码:3009

外文期刊名:JOURNAL OF APPLIED POLYMER SCIENCE

收录:;EI(收录号:20082011258292);WOS:【SCI-EXPANDED(收录号:WOS:000255043100034)】;

语种:英文

外文关键词:phenolic resin; solution properties; viscosity; conformation analysis; curing of polymer

摘要:The research indicates that in comparison with other solvents, such as ethanol, propanol, butyl alcohol and acetone, which are usually selected as the solvent in phenolic solution, methanol can increase curing rate and enhance crosslinking density of phenolic resins. Therefore, the chain conformations of resole dissolved in different solvents are investigated by using viscosity method. It shows that the chain conformation of resoles changes from loose coil to compact ball, as the strength of hydrogen bond between resole and solvent drops along with the decrease of polarity of solvents. The transition of the chain conformation causes the decrease of reaction probability and reaction rate between functional groups of resoles. The number of unreacted molecules increases, and the crosslinking density of cured resins decreases. The differential scanning calorimetric analysis shows that compared with the resins in methanol, ethanol, propanol, and butyl alcohol, exothermic peak of resole in acetone is obviously wider, and its peak exothermic temperature is lower. Both optical microscope pictures and atomic force microscope pictures demonstrate that the crosslinking density of resins in methanol is higher than those in other solvents. The research concludes that the type of solvent has a great influence on the curing rate and curing degree of resoles. (C) 2008 Wiley Periodicals, Inc.

参考文献:

正在载入数据...

版权所有©华东理工大学 重庆维普资讯有限公司 渝B2-20050021-7 
渝公网安备 50019002500408号 违法和不良信息举报中心