文献类型：期刊文献

英文题名：Synthesis of Quaternary Ammonium Salts Based on Diketopyrrolopyrroles Skeletons and Their Applications in Copper Electroplating

作者：Chen, Biao[1];Xu, Jie[1];Wang, Limin[1];Song, Longfeng[1];Wu, Shengying[1]

机构：[1]East China Univ Sci & Technol, Shanghai Key Lab Funct Mat Chem, Meilong Rd, Shanghai 200237, Peoples R China

年份：2017

卷号：9

期号：8

起止页码：7793

外文期刊名：ACS APPLIED MATERIALS & INTERFACES

收录：;EI(收录号：20171003413221);WOS:【SCI-EXPANDED(收录号:WOS:000395494200127)】；

基金：This research was financially supported by the National Natural Science Foundation of China (grant nos. 21272069 and 20672035) and the Fundamental Research Funds for the Central Universities and Key Laboratory of Organofluorine Chemistry Shanghai Institute of Organic Chemistry, Chinese Academy of Sciences.

语种：英文

外文关键词：diketopyrrolopyrrole; quaternary ammonium salts; leveler; electroplating; microvia

摘要：A series of DPP derivatives bearing quaternary ammonium salt centers with different lengths of carbon chains have been designed and synthesized. Their inhibition actions on copper electroplating were first investigated. A total of four diketopyrrolopyrrole (DPP) derivatives showed different inhibition capabilities on copper electroplating. To investigate interactions between metal surface and additives, we used quantum chemical calculations. Static and dynamic surface tension of four DPP derivatives had been measured, and the results showed DPP-10C (1c) with a faster-decreasing rate of dynamic surface tension among the four derivatives, which indicated higher adsorption rate of additive on the cathode surface and gives rise to stronger inhibiting effect of copper electrodeposition. Then, DPP-10C (1c) as the representative additive, was selected for the systematic study of the leveling influence during microvia filling through comprehensive electroplating tests. In addition, field emission scanning electron microscope images and X-ray diffraction results showed the surface morphology, which indicated that addition of DPP derivative (1c) could lead a fine copper deposit and cause the preferential orientations of copper deposits to change from [220] to [111], which happened in particular at higher concentrations.