文献类型：期刊文献

英文题名：Significantly enhanced thermal conductivity of polymer composites via establishing double-percolated expanded graphite/multi-layer graphene hybrid filler network

作者：Liu, Chao[1];Wu, Wei[1];Drummer, Dietmar[2];Wang, Yi[1];Chen, Qiming[1];Liu, Xingrong[1];Schneider, Kevin[2]

机构：[1]East China Univ Sci & Technol, Sch Mat Sci & Engn, Sino German Joint Res Ctr Adv Mat, Shanghai 200237, Peoples R China;[2]Friedrich Alexander Univ Erlangen Nuremberg, Inst Polymer Technol, D-91058 Erlangen, Germany

年份：2021

卷号：160

外文期刊名：EUROPEAN POLYMER JOURNAL

收录：;EI(收录号：20214110992695);WOS:【SCI-EXPANDED(收录号:WOS:000708576600004)】；

基金：This work was funded by the Chinese German Centre for the Promotion of Science via the National Natural Science Foundation of China (NSFC) and Deutsche Forschungsgemeinschaft (DFG) (No. GZ1448) . C. L. would like to acknowledge the financial support from the "International Cooperative Training Program for Innovative Talents" of the China Scholarship Council (No. 201906745023) .

语种：英文

外文关键词：Graphene; Expended graphite; Synergy; Thermal conductivity; Polymer composites

摘要：Utilization of hybrid fillers with high thermal conductivity enhancement (TCE) efficiency is an effective method for the large-scale fabrication of polymeric thermal interface materials (TIMs) with exceptional thermal conductivity. Herein, we report the thermally conductive properties of thermoplastic urethane (TPU) composites incorporated with expanded graphite (EG) and multi-layer graphene (MLG). The effect of percolation behavior of EG/MLG hybrid fillers on the thermal conductivity is systematically revealed. It is found that the high-loading TPU composite with 20 wt% EG and 10 wt% MLG reveals an exceptional thermal conductivity of 8.52 Wm(-1)K(-1), which corresponds to a TCE of 3450% compared to that (0.24 Wm(-1) K-1) of pure TPU matrix. Notably, the TCE per 1 wt% filler reaches a substantial value of 115%. The thermally conductive mechanism is proposed based on morphology and thermal contact resistance analyses. Moreover, the application of such TPU composites in thermal management of light-emitting diode lamps is exhibited, and the effectiveness is further verified through finite element simulation. Our results shed light on the significant thermal synergy between EG and MLG and demonstrate their application potential in high-performance TIMs.