详细信息
Influence of 1,8-Naphthalimide Derivatives as Additives on the Electrodeposition of Tin from Msa System ( EI收录)
文献类型:期刊文献
英文题名:Influence of 1,8-Naphthalimide Derivatives as Additives on the Electrodeposition of Tin from Msa System
作者:Xie, Yiqiu[1]; Du, Lei[1]; Li, Xuyang[1]; Yuan, Bo[1]; Bao, Guoqing[1]; Wang, Limin[1]
机构:[1] Key Laboratory for Advanced Materials, Institute of Fine Chemicals, School of Chemistry & Molecular Engineering, East China University of Science and Technology, 130 Meilong Road, Shanghai, 200237, China
年份:2022
外文期刊名:SSRN
收录:EI(收录号:20220122437)
语种:英文
外文关键词:Additives - Aromatic compounds - Deposition rates - Electrodeposition - Electrodes - Electrolytes - Hydrogen - Quantum chemistry
摘要:Tin electrodeposition is widely used in the food packaging, printed circuit, semiconductor industries, and many others. In order to get high quality tin coatings, additives are added to plating baths. However, the design of additives with simple synthetic steps and excellent performance remains a challenging and little explored problem. Therefore, in this paper, a series of 1,8-naphthalimide derivatives containing different quaternary ammonium groups have been synthesized by a two-step method, which is the first application of such compounds in the field of tin electroplating. Electrochemical tests and quantum chemical calculations demonstrated that 1,8-naphthalimide parent conjugate ring adsorbed to metal surface and occupied active sites, and positive charges on aromatic ring quaternary ammonium group competed with Sn 2+ for electrons. Moreover, larger conjugate area of aromatic ring quaternary ammonium group and higher number of positive charges were considered to increase cathodic polarization to inhibit deposition rate of tin ions and hydrogen evolution. NI4 which had a current density suppression effect of 90% and negatively shifted tin deposition and hydrogen evolution potential by 20 mV and 0.45 V respectively was deemed to the best performed one on this basis. In actual tin plating, compared with base electrolyte, the tin layer surface under NI4 electrolyte was smoother at any current density and had no leakage or agglomeration. SEM showed a higher nuclei density with a smaller feature size, and XRD demonstrated a shift in the dominant crystalline plane from (420) to (200). ? 2022, The Authors. All rights reserved.
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