文献类型：期刊文献

中文题名：化学镀铜新工艺

英文题名：Study on Electroless Copper Plating

作者：赵斌[1];方晓[1];毛德芳[1]

机构：[1]华东理工大学化学系

年份：1997

卷号：23

期号：3

起止页码：367

中文期刊名：华东理工大学学报（自然科学版）

外文期刊名：Journal of East China University of Science and Technology

收录：CSTPCD;;EI(收录号：1997123980621);Scopus;北大核心:【北大核心1996】；CSCD:【CSCD2011_2012】；

语种：中文

中文关键词：化学镀;镀铜;添加离子;耐磨损性能;耐剥离性

外文关键词：electroless plating; copper plating; metal ion additives; heat treatment;anti wear property; anti stripping property

摘要：优化了以甲醛为还原剂，ＥＤＴＡ为络合剂的碱性化学镀铜的基本配方。探讨了铅、锰、镍、锌、钙、锶等金属离子及铵离子对镀速和镀层耐磨损性能、耐剥离性能的影响。结果表明，铅离子的加入在基本不影响镀速的情况下，大大提高了镀层的耐磨损性能和耐剥离性能。还研究了在不同温度条件的热处理对化学镀铜层抗氧化能力和耐磨损性能的影响。
This work optimized the recipe of alkaline electroless copper plating with formaldehyde(37%) as reducing agent and EDTA as complexing agent.The effects of metal ions additives,such as Pb 2+ ,Mn 2+ ,Ni 2+ ,NH + 4,Zn 2+ ,Ca 2+ ,Sr 2+ ,etc.on plating rate,anti wear property and anti stripping property were studied.It was showed that the addition of Pb 2+ raised the anti wear property and the anti stripping property of the film greatly without remarkable negative effect on the plating rate.In addition,the effect of heat treatment temperature of on anti oxidizing property and anti wearing property was studied.The best temperature of heat treatment is 90°C.