成果/Result
- A New Analysis of the Capillary Driving Pressure for Underfill Flow in Flip-Chip Packaging被引量：26收藏
- 作者：Yao, Xing Jun Wang, Zheng Dong Zhang, Wen Jun
- 机构：E China Univ Sci & Technol;E China Univ Sci & Technol;Univ Saskatchewan
- 来源：IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 2014
- 关键词：Capillary force flip chip fluid-solid interaction modeling underfill flow
- A New Model for Permeability of Porous Medium in the Case of Flip-Chip Packaging被引量：17收藏
- 作者：Yao, Xing Jun Wang, Zhengdong Zhang, Wenjun Zhou, Xingyan
- 机构：E China Univ Sci & Technol;E China Univ Sci & Technol;Univ Saskatchewan
- 来源：IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 2014
- 关键词：Flip-chip permeability power law model solder bumps configuration underfill
- A Further Study on the Analytical Model for the Permeability in Flip-Chip Packaging被引量：11收藏
- 作者：Yao, X. J. Fang, J. J. Zhang, Wenjun
- 机构：East China Univ Sci & Technol;Shanghai Univ;Univ Saskatchewan
- 来源：JOURNAL OF ELECTRONIC PACKAGING 2018
- 关键词：flip-chip packaging underfill superficial cross-sectional area pore average cross-sectional area superficial permeability pore permeability
- An Analytical Model for Permeability of Underfill Flow in Flip-Chip Packaging With Consideration of the Actual Specific Surface and Tortuosity被引量：9收藏
- 作者：Yao, Xing Jun Zhang, Wen Jun
- 机构：East China Univ Sci & Technol;Shanghai Univ;Univ Saskatchewan
- 来源：IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 2018
- 关键词：Differential element method (DEM) flip-chip packaging permeability porous medium specific surface tortuosity underfill
