成果/Result
- A New Analysis of the Capillary Driving Pressure for Underfill Flow in Flip-Chip Packaging被引量：26收藏
- 作者：Yao, Xing Jun Wang, Zheng Dong Zhang, Wen Jun
- 机构：E China Univ Sci & Technol;E China Univ Sci & Technol;Univ Saskatchewan
- 来源：IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 2014
- 关键词：Capillary force flip chip fluid-solid interaction modeling underfill flow
- Comparison of the degradation behavior of PLGA scaffolds in micro-channel, shaking, and static conditions被引量：20收藏
- 作者：Ma, C. H. Zhang, H. B. Yang, S. M. Yin, R. X. Yao, X. J. Zhang, W. J.
- 机构：East China Univ Sci & Technol;Shanghai Univ;Univ Saskatchewan
- 来源：BIOMICROFLUIDICS 2018
- 关键词：Porosity - Tissue regeneration - Computational fluid dynamics - Scaffolds (biology) - pH
- A New Model for Permeability of Porous Medium in the Case of Flip-Chip Packaging被引量：17收藏
- 作者：Yao, Xing Jun Wang, Zhengdong Zhang, Wenjun Zhou, Xingyan
- 机构：E China Univ Sci & Technol;E China Univ Sci & Technol;Univ Saskatchewan
- 来源：IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 2014
- 关键词：Flip-chip permeability power law model solder bumps configuration underfill
- A Further Study on the Analytical Model for the Permeability in Flip-Chip Packaging被引量：11收藏
- 作者：Yao, X. J. Fang, J. J. Zhang, Wenjun
- 机构：East China Univ Sci & Technol;Shanghai Univ;Univ Saskatchewan
- 来源：JOURNAL OF ELECTRONIC PACKAGING 2018
- 关键词：flip-chip packaging underfill superficial cross-sectional area pore average cross-sectional area superficial permeability pore permeability
- An Analytical Model for Permeability of Underfill Flow in Flip-Chip Packaging With Consideration of the Actual Specific Surface and Tortuosity被引量：9收藏
- 作者：Yao, Xing Jun Zhang, Wen Jun
- 机构：East China Univ Sci & Technol;Shanghai Univ;Univ Saskatchewan
- 来源：IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 2018
- 关键词：Differential element method (DEM) flip-chip packaging permeability porous medium specific surface tortuosity underfill
- A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging被引量：5收藏
- 作者：Yao, Xingjun Jiang, Weijie Yang, Jiahui Fang, Junjie Zhang, Wenjun
- 机构：East China Univ Sci & Technol;Univ Saskatchewan
- 来源：JOURNAL OF ELECTRONIC PACKAGING 2022
- 关键词：flip-chip underfill surface energy conservation of energy
